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 AP3302H/J
Advanced Power Electronics Corp.
Low Gate Charge Simple Drive Requirement Fast Switching G S
N-CHANNEL ENHANCEMENT MODE POWER MOSFET D
BVDSS RDS(ON) ID
25V 50m 16A
Description
The TO-252 package is universally preferred for all commercialindustrial surface mount applications and suited for low voltage applications such as DC/DC converters. The through-hole version (AP3302J) is available for low-profile applications.
G DS
TO-252(H)
G
D
S
TO-251(J)
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current
1
Rating 25 20 16 10 25 20 0.16 -55 to 150 -55 to 150
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-case Rthj-amb Parameter Thermal Resistance Junction-case Thermal Resistance Junction-ambient Max. Max. Value 6.4 110 Unit /W /W
Data & specifications subject to change without notice
200701031
AP3302H/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS RDS(ON) VGS(th) IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance Gate Threshold Voltage
Drain-Source Leakage Current (Tj=25 C) Drain-Source Leakage Current (Tj=150 C)
o o
Test Conditions VGS=0V, ID=250uA
2
Min. 25 2 -
Typ. 7.4 2.2 4.2 8 7.4 11 3 164 158 62
Max. Units 50 4 1 25 100 13 290 V m V uA uA nA nC nC nC ns ns ns ns pF pF pF
VGS=10V, ID=8A VDS=VGS, ID=250uA VDS=25V, VGS=0V VDS=20V, VGS=0V VGS= 20V ID=10A VDS= 24V VGS=10V VDS=15V ID=16A RG=3.3,VGS=10V RD=0.94 VGS=0V VDS=25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol VSD Parameter Forward On Voltage
2
Test Conditions IS=16A, VGS=0V IS=16A, VGS=0V, dI/dt=100A/s
Min. -
Typ. 29 21
Max. Units 1.3 V ns nC
trr
Qrr
Reverse Recovery Time Reverse Recovery Charge
Notes:
1.Pulse width limited by safe operating area. 2.Pulse width <300us , duty cycle <2%.
AP3302H/J
25 11
T c =25 o C
20
10V
10
T c =150 o C
9
10V 9.0V 8.0V
ID , Drain Current (A)
ID , Drain Current (A)
9.0V
15
8
7
6
7.0V
5 4
8.0V
10
5
7.0V V G =5.0V
3
2
V G =5.0V
1
0 0 1 2 3 4 5 6
0 0 1 2 3 4
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
30
1.8
1.6
I D =20A V G =10V
Normalized RDS(ON)
20
1.4
PD (W)
1.2
10
1.0
0.8
0
0.6
0 50 100 150 -50 0 50 100 150
T j , Junction Temperature ( C)
o
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
5
100
4.5
10
4
IS (A)
VGS(th) (V)
T j =150 o C
1
T j =25 C
o
3.5
3
0.1 2.5
2 0.01 0 0.4 0.8 1.2 1.6 -50 0 50 100 150
V SD , Source-to-Drain Voltage (V)
T j ,Junction Temperature (
o
C)
Fig 5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
AP3302H/J
f=1.0MHz
25
1000
I D =10A VGS , Gate to Source Voltage (V)
20
15
C (pF)
V DS =20V V DS =16V V DS =12V
Ciss
100
Coss Crss
10
5
0 0 2 4 6 8 10 12
10
1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
V DS , Drain-to-Source Voltage (V)
Fig7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
10
Normalized Thermal Response (Rthjc)
DUTY=0.5
0.2
ID (A)
1
10ms 100ms 1s DC
0.1
0.1
0.05
PDM
0.02
t
0.01
0.1
T
Duty factor = t/T Peak Tj = PDM x Rthjc + T C
T c =25 o C Single Pulse
0.1 1 10 100
Single Pulse
0.01
0.01 0.00001 0.0001 0.001 0.01 0.1 1
V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG QG 10V QGS QGD
10% VGS td(on) tr td(off) tf Charge Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform


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